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In fully depleted SO1 MOSFET, the transconductance can be obtained from in a similar way:
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electronics of BaBar vertex detector. Nucl. Instrum. Methods A 377, 459 464 (1996). Berger, M.J., Hubbell, J.H., Seltzer, S.M., Coursey, J.S. and Zucker, D.S., XCOM: Photon Cross Section Database (version 1.2), Available: http://physics.nist.gov/xcom. National Institute of Standards and Technology, Gaithersburg, MD (1999). Originally published as Berger, M.J. and Hubbell, J.H. Photon Cross Sections on a Personal Computer, NBSIR 87 3597; and as Berger, M.J. and Hubbell, J.H., NIST X-ray and Gamma-ray Attenuation Coef cients and Cross Sections Database, NIST Standard Reference Database 8. National Institute of Standards and Technology, Gaithersburg, MD (1987). Bertuccio, G., Fasoli, L. and Sampietro, M., Design criteria of low-power low-noise charge ampli ers in VLSI bipolar technology. IEEE Trans. Nucl. Sci. 44, 1708 1718 (1997). Besch, H.J., Radiation detectors in medical and biological applications. Nucl. Instrum. Methods A 419, 202 216 (1998). Bielajew, A.F., Hirayama, H., Nelson, W.R. and Rogers, D.W.O., History overview and improvements of EGS4, SLAC Report, SLAC-PUB-6499 (1994). Breibach, J., Lubelsmeyer, K., Masing, Th. and Rente, C., Investigation of a bump bonding interconnect technology for GaAs pixel detectors. Nucl. Instrum. Methods A 470, 571 575 (2001). Cederstr m, B., Danielsson, M., Lundqvist, M. and Nygren, D., o High-resolution X-ray imaging using the signal time dependence on a double-sided silicon detector. Nucl. Instrum. Methods A 423, 135 145 (1999). Chen, J., Geppert, R., Irsigler, R., Ludwig, J., P ster, J., Plotze, T., Rogalla, M., Runge, K., Schafer, F., Schmid, Th., Soldner-Rembold, S. and Webel, M., Beam test of GaAs strip detectors. Nucl. Instrum. Methods A 369, 62 62 (1996). Cihangir, S. and Kwan, S., Characterization of indium and solder bump bonding for pixel detectors. Nucl. Instrum. Methods A 476, 670 675 (2001). Colledani, C., Dulinski, W., Turchetta, R., Djama, F., Rudge, A. and Weilhammer, P., A submicron precision silicon telescope for beam test purposes. Nucl. Instrum. Methods A 372, 379 384 (1996). Comes, G., Loddo, F., Hu, Y., Kaplon, J., Ly, F., Turchetta, R., Bonvicini, V. and Vacchi, A., CASTOR: a VLSI CMOS mixed analog-digital circuit for low noise multichannel counting applications. Nucl. Instrum. Methods A 377, 440 445 (1996). D browski, W., Bia as, W., Grybo , P., Idzik, M. and Kud aty, a s J., A readout system for position sensitive measurements of X-ray using silicon strip detectors. Nucl. Instrum. Methods A 442, 346 354 (2000). De Geronimo, G., O Connor, P., Radeka, V. and Yu, B., Front-end electronics for imaging detectors. Nucl. Instrum. Methods A 471, 192 199 (2001). De Geronimo, G., Kandasamy, A. and O Connor, P., Analog peak detector and derandomizer for high rate spectroscopy. Presented at the IEEE Nuclear Science Symposium, San Diego, paper N10 4 (2001).
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You can apply limits to distance and angle mates in order to allow the parts to move within a certain range of values. Figure 13.15 shows the PropertyManager interface for the Limit Angle mate. Limit mates accept zero and negative values that are not normally accepted for dimensions in SolidWorks. When used properly, Limit mates can be an extremely powerful tool for creating more realistic motion in assemblies. On the CD-ROM, open the assembly named 13 Robot Limit Mate.sldasm. Drag the Robot Tower part. Notice that it only rotates within a limited angle. LimitAngle2 is the mate that is driving this motion.
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You can now add a dimension to the design table. To add a dimension, it is most convenient to display the dimensions on the screen at all times. To show all of the dimensions in the part, RMB click the Annotations folder in the FeatureManager and select Display Annotations. If the dimensions do not display, then you may have to go back and select Show Feature Dimensions. Arrange the dimensions so that you can clearly see them all, as shown in Figure 10.18.
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