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ELECTRODEPOSITION OF OXIDE SUPERCONDUCTORS
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Curve Through XYZ Points
must be made for the environment the product is used in, in addition to having all cables connected to the system operating in a worst-case mode. Data must be physically present on interconnect cables that are properly terminated, not just dangling from the equipment under test (EUT). When installing a system under this pitfall, significant EMI problems are possible. Most units are provided to the test house without proper cables and installation instructions. Components may have been declared compliant based on a certain environment which may be inappropriate for the end-use product. An example is using an assembly tested for a heavy-industrial application but installed in a residential environment. After certification, changes to the product may happen without retesting to ensure continued conformity, assuming that the change has no effect on EMC. No quality control system may exist to verify that all products are copy exact. An example is die-shrink for silicon components. Purchasers may substitute counterfeit components for legitimate ones by mistake or without knowledge of a change in provider if buying through distribution. Both good and poor components may be mixed together in the stockroom. Buying products with a Declaration of Conformity (DOC) does not mean that due diligence was applied in the certification process. Buying a product in good faith is not a legal defense under most European directives, especially when the end-use application is not tested. Mistakes may have happened that allow a product to be certified as compliant when in fact the unit fails. The manufacturer remains liable for the performance of the product in production quantities. It therefore becomes important to use quality test facilities that are accredited or assessed every year by third-party experts. With the points noted above, either emissions or immunity may be compromised by the weakest component. With various subassemblies connected together, a summation of emissions can develop to the point where the system is now not compliant or interconnect cables may be susceptible to externally induced events. Unattended Installations
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Part II
Directionally resolved channel measurements, and models based on those measurements, are important for the design and simulation of multiantenna systems (see s 6 and 7). In the rst three subsections of this section, we discuss how to make measurements that are directionally resolved at just the RX. These concepts are then generalized to Multiple Input Multiple Output (MIMO) measurements (directionally resolved at both link ends) at the end of this section. Fortunately, it is not necessary to devise directional channel sounders from scratch. Rather, a clever combination of existing devices can be used to allow directional measurements. We can distinguish two basic approaches: measurements with directional antennas and array measurements. Measurements with directional antennas: a highly directive antenna is installed at the RX. This antenna is then connected to the RX of a regular channel sounder. The output of the RX is thus the impulse response of the combination of the channel and the antenna pointing in a speci c direction, i.e., h(t, , i ) = h(t, , )GRX ( i ) d (8.28) 1 1 The fastest way to access a Web site is, of course, to enter its URL into the Address bar. (See the Accessing Web sites quickly section, earlier in this chapter.) However, you can locate Web pages other ways even if you don t know a site s URL. Fortunately, IE7 has built-in features to help you find these sites. Profile Server
INTRODUCTION TO ISDN AND DSS1
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