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The following instructions are based on the assumption that you are installing a genuine, retail edition of Windows Vista. To perform a custom installation, follow these steps: 1. Insert your Windows Vista DVD-ROM, boot your computer, and wait until it loads. A custom installation must originate as a boot disk and cannot be performed directly from your existing Windows operating system. 2. Select your desired language, time, currency format, and keyboard layout (Figure 3.1) from the installation window. Click Next.
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Part 4: Using the Ubuntu Server
Application Building Basics
Memory cell structure: DRAM (dynamic random access memory) circuits, 333-336, 346, 348-351 scaling techniques, 335-339 ferroelectric memory, 458-463 destructive readout structure, 459-462 SRAM-type structure, 462 transistor structure, 462-463 floating-gate memory arrays, 393 byte-alterable E2 PROMs, 402-406 flash EEPROM memories, 406-421 future trends in, 426-430 reliability, 421-426 UV EPROMS, 393-402 silicon nitride memory, 442-448 gated-access structure, 444-446 shadow RAM structure, 446-448 single-gate structure, 443-444 Memory circuits, heterogeneous ICs, system-onchip concepts, 635-636 Memory window, silicon nitride memory, 431 radiation hardness, 442 MESFET, ULSI applications, 7 Mesoscopic systems, universal conductance fluctuations, 216 Metal oxide silicon (MOS), developmental history, 19. See also MOSFETs Microwave MOSFETs, silicon-on-insulator (SOI) configuration, 237-238 MICROX, microwave MOSFETs, 237-238 Miller capacitance, high-speed digital applications: gate-to-drain overlap capacitance (CGD), 577-578 noise parameters, 607-616 Miller opamp, low-voltage, low-power (LVLP) circuits, 256-259 Minimum channel length (Lmin), high-speed digital applications, SCE-channel dopant N,ub engineering, 558-559 Minimum detectable signal (MDS) level, CMOS low-noise amplifiers (LNA), 498-508 Minimum noise factor, CMOS low-noise amplifiers (LNA), 495-508 optimum source impedance, 499-508 Minority carrier concentration: dual-gate MOSFET, 245-248 inner-box shaped transistor, 27-30 high-frequency behavior, 35-39 temperature dependence, 39-42 Mixed-signal circuits, system-on-chip concepts, 639-644 feature size, 641-642 process options, 642-643
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